Complete Compact Vacuum Hot Flat Press For Wafer Bonding (50x50mm Area, 500 Max 500kg) - Vhp-5000n2 Series [spu43cUJ]

Efficient and Compact Vacuum Hot Flat Press

Introducing the VHP-5000N2, a compact and highly efficient vacuum hot flat press designed for wafer bonding and film transfer applications. This advanced equipment is a must-have for researchers and engineers in the semiconductor industry, offering superior performance and accuracy for sintered bonding research of third-generation semiconductor devices. With its maximum sample size of 50mm x 50mm and a maximum operating temperature of 500°C, the VHP-5000N2 is perfectly suited for a wide range of applications, ensuring reliable and consistent results.

Robust Specifications and Technical Details

The VHP-5000N2 boasts a range of robust specifications that make it an ideal choice for semiconductor preparation processes. Its maximum pressure of 5000N ensures strong bonding capabilities, while the vacuum and atmosphere environment minimizes material oxidation. The equipment features two heating plates made of heat-resistant stainless steel, capable of reaching a maximum temperature of 500°C in less than 30 minutes. The precision digital temperature controllers offer independent control for both heating plates, with up to 30 programmable segments for optimal heating, dwelling, and cooling. Additionally, the dual-mode electric oil-free press provides a constant pressure accuracy of ±1Kg (±10N) for reliable and consistent results.

Practical Applications and Target Audience

The VHP-5000N2 is a versatile tool that finds practical applications in various industries. Whether you are working on semiconductor packaging, interconnection materials, or any other research requiring wafer bonding or film transfer, this compact vacuum hot flat press is an excellent choice. Its cost-effective design and exceptional performance make it a valuable asset for laboratory R&D environments, research institutions, and manufacturing facilities. By investing in the VHP-5000N2, you are ensuring access to a reliable and efficient solution for your wafer bonding needs.