Worldwide Shipping Silicon-on-sapphire (11-02, R Plane ), 100mm Dia X 0.46mm,1sp, Film: 0.6 Um Thick 70% Off - Today Only [gDO1cbuj]
Silicon on sapphire (SOS) is a hetero-epitaxialprocess for integrated circuitmanufacturing that consists of a thin layer (typically thinner than 0.6 micrometres) of silicongrown on a sapphire (Al2O3) wafer. SOS is part of the Silicon on Insulator (
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SOS(Silicon on Sapphire) Wafers (DSP-Double sides polished)
- Silicon Orientation: (100)
- Type, Dopant: Intrinsic type, undoped
- Silicon Thickness: 0.6 um +/- 10%
- Resistivity: > 100 ohm.cm
- Micro-particle density ( for particles > 2 um) < 2/cm^2
- R plane -- (1-102) with single flat
Purity: 99.996% - Wafer size: 100 mm dia x 0.46 mm thickness
- Flat : One flat 32.5mm +/-2.5mm, at 45+/- 1 deg CCW from <C> on <R>
- Front surface: Epi-polished (Ra < 4 nm)
- Back surface: Fine ground
- TTV < 15 um, Bow < 20 um, Warp < 20 um, Flatness (TIR) < 12 um, with Laser Mark on wafer back-side, just below the Flat
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