Genius Solution Vgf-ge Wafer (100) 100mm Dia X 0.5 Mm, 1sp, N Type ( As- Doped), R: 0.088- 0.183ohm.cm Guaranteed [pCa21DT9]
Ge Wafer SpecificationGrowing Method: VGFOrientation: (100) +/-0.5 Deg.Wafer Size: 100mm dia x 500 microns Surface Polishing: One side epi polishedSurface roughness:
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Genius Solution Vgf-ge Wafer (100) 100mm Dia X 0.5 Mm, 1sp, N Type ( As- Doped), R: 0.088- 0.183ohm.cm Guaranteed [pCa21DT9]
Ge Wafer Specification
- Growing Method: VGF
- Orientation: (100) +/-0.5 Deg.
- Wafer Size: 100mm dia x 500 microns
- Surface Polishing: One side epi polished
- Surface roughness: RMS or Ra:~ 10 A(By AFM)
- Conductor type: N-type
- Resistivity: 0.088-0.183 ohm.cm (If you would like to measure the resistivity accurately,
please order our Portable 4 Probe Resistivity Testing Instrument.) - Carrier concentration: (0.78-3.02)x10^16/c.c
- Mobility: 2350-3010 cm^2.v.s
- EPD: < 500 /cm^2
- Ra(Average Roughness) : < 0.4 nm
- Package: under 1000 class clean room
Typical Properties:
- Structure: Cubic, a = 5.6754Å
- Density: 5.323 g/cm3 at room temperature
- Melting Point: 937.4 oC
- Thermal Conductivity: 640
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