The Perfect Srtio3 (100)+/-0.1 Deg 10x10x0.5 Mm Epi Polished Wafer 1 Sp, - Stoa101005s1deg01 Diy Kit [8veGb076]

SrTiO3 Epi-Polished Wafer for Advanced Applications

The SrTiO3 (100)+/-0.1 deg 10x10x0.5 mm Epi polished wafer is a premium-grade substrate that offers exceptional lattice matching capabilities with most materials featuring a Perovskite structure. This wafer is an ideal choice for epitaxial growth of High-Temperature Superconducting (HTS) materials and a variety of oxide thin films. With its superior quality and cost-effectiveness, this wafer is a preferred choice for researchers and manufacturers in the field of advanced materials and device fabrication.

Key Product Specifications and Features

Our SrTiO3 wafer is meticulously crafted to meet the highest industry standards. It boasts a size of 10x10x0.5 mm with an orientation of (100) +/-0.1° and edge orientation indication of <001> +/-2°. The surface finish is achieved through EPI polishing with less sub-surface lattice damage, ensuring an ultra-smooth and precise finish. The wafer is packed in a 100 grade plastic bag under a 1000 class clean room, guaranteeing its cleanliness and integrity. Some of the key features include:

• Size: 10x10x0.5 mm (1.0mm thickness available as an option)
• Orientation: (100) +/-0.1°
• Polish: One side EPI polished with less sub-surface lattice damage
• Surface finish (RMS or Ra): <5A

Applications and Benefits

The versatile nature of SrTiO3 makes it suitable for a wide range of applications. It is widely used for special optical windows and as a high-quality sputtering target. In the realm of thin film technology, it serves as an excellent substrate for epitaxial growth of HTS materials, oxide thin films, and more. The high purity of our SrTiO3 single crystal ensures its stability and reliability in various environments. By using our epi-polished wafers, customers can expect several benefits, including:

• Improved epitaxial growth: The high-quality lattice matching of SrTiO3 enables better epitaxial growth of thin films, resulting in enhanced device performance.
• Optimized device fabrication: The precise surface finish and cleanliness of the wafer contribute to the production of high-quality devices with improved yields.
• Cost-effectiveness: Our wafer offers an affordable solution without compromising on quality, making it an ideal choice for research and commercial applications.