Lightweight 6" Electroplated Diamond Wafering Blade (coarse Grit), Wb-060epd Collection [j9MFDsaT]

6" Electroplated Diamond Wafering Blade (Coarse Grit)

Welcome to our premium line of diamond wafering blades, where precision and durability meet to provide unparalleled performance. Our 6" Electroplated Diamond Wafering Blade (Coarse Grit), model WB-060EPD, is a testament to our commitment to excellence in cutting tools. Engineered with cutting-edge technology, this blade boasts exceptional sharpness and long-lasting wear resistance, making it ideal for a variety of industrial and professional applications.

• Dimensional Accuracy: The blade measures 6-inch in diameter, 0.032-inch in thickness, and 0.5-inch in length, ensuring a precise fit for your wafering machine.
• Grit Quality: Our coarse grit option offers an excellent balance between cutting speed and surface finish, making it versatile for various materials and processes.

Product Specifications and Technical Details

Our 6" Electroplated Diamond Wafering Blade (Coarse Grit) is meticulously crafted for optimal performance. The electroplating process ensures a strong bond between the diamond particles and the metal substrate, resulting in superior durability and resistance to wear. Here are some key specifications:

• Material: The blade is made of high-quality steel, providing excellent strength and stability.
• Grit Size: The coarse grit offers a rougher cutting edge, which is perfect for applications requiring a higher material removal rate.
• Coating: The electroplated diamond coating guarantees a long service life and exceptional cutting performance.

This blade is designed to meet the demands of professionals in semiconductor, optical, and precision engineering industries, where high precision and reliability are paramount.

Practical Uses and Target Audience

Our 6" Electroplated Diamond Wafering Blade (Coarse Grit) is the go-to choice for professionals who require top-notch performance in wafer cutting. Whether you are a semiconductor engineer, optical fabricator, or a hobbyist, this blade will enhance your productivity and efficiency in the following scenarios:

• Industries: Perfect for semiconductor wafer processing, optical fiber production, and other precision engineering applications.
• Applications: Ideal for cutting various materials, including silicon, quartz, sapphire, and other hard-to-cut substrates.

Invest in our WB-060EPD blade and experience the difference in quality and performance that only our cutting-edge products can deliver. Choose us for reliable, precision cutting solutions that will elevate your work to new heights.