Restock Alert Chiplet And Heterogenous Integration Us & Asia 08/18/2025 - Why Pay More? [KG8HF3ER]

Explore the Future of Chiplet and Heterogeneous Integration

Discover the cutting-edge advancements in microelectronics packaging with SEMI's Chiplet & Heterogeneous Integration for Microelectronics Packaging workshop. This comprehensive training program is designed to equip industry professionals with the knowledge and skills necessary to navigate the rapidly evolving landscape of chiplet and heterogeneous integration technologies.

With dates scheduled for August 18th - August 19th, 2025, and a convenient 2:00 PM - 6:00 PM PT time slot, this virtual event offers flexibility without compromising on the quality of learning. The workshop's location is virtual, ensuring accessibility to a global audience while fostering an interactive learning environment.

Join us to delve into the essential components of chiplet and heterogeneous integration, including IC carriers, 3D stacking, TSV, fan-in, fan-out wafer-level packaging, and embedded multi-die interconnects. Our expert instructors will provide a deep dive into the challenges and opportunities that come with these innovative technologies, empowering you to drive innovation and stay ahead in the competitive microelectronics market. Don't miss out on this opportunity to enhance your expertise and expand your professional network.

• Gain an in-depth understanding of the latest advancements in chiplet and heterogeneous integration.
• Learn from industry experts and network with peers in a dynamic virtual setting.