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Holiday Special G09900 - Semi G99 - Specification For Flowability Of Encapsulation Materials For Wafer Level Packaging And Panel Level Packaging Now 75% Cheaper [UXId9wjE]
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Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three
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Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these requires the different characteristics and performances.
The characteristics of encapsulation materials such as flowability needs to be recognized and defined to enable the qualified encapsulation processes for large panel size.
This Specification focuses on the flowability of encapsulation material used in the manufacturing of WLP and PLP processes.
Two methodologies are defined to measure the flowability by either using a Spiral Flow or a Disk Compression technique.
- Spiral Flow can be applied to granular type of encapsulation material.
- Disk Compression can be applied to all three types of encapsulation materials.
Referenced SEMI Standards (purchase separately)
SEMI G83 — Specification for Bar Code Marking of Product Packages
Revision History
SEMI G99-1122 (first published)
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