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Going Fast G03700 - Semi G37 - Specification For Dimensions And Tolerances Used To Manufacture Plastic Molded Small Outline Package Tooling With A 30% Price Cut [Zw6yfe8Q]
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This document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end-of-line toolmakers as the basis for defining
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Going Fast G03700 - Semi G37 - Specification For Dimensions And Tolerances Used To Manufacture Plastic Molded Small Outline Package Tooling With A 30% Price Cut [Zw6yfe8Q]
Referenced SEMI Standards
None.
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