Handcrafted E11500 - Semi E115 - Test Method For Determining The Load Impedance And Efficiency Of Matching Networks Used In Semiconductor Processing Equipment Rf Power Delivery Systems Save 30% + Free Ship [hscFCP2H]

The purpose of this Standard is to define a test method used to determine the load impedance and efficiency of matching networks used in RF power delivery systems for semiconductor processing equipment.

This Standard specifies the testing procedures and test equipment required for determining the load impedance and power efficiency of a matching network based on the positions of the tuning elements in the matching network.

The primary focus for this Test Method is semiconductor processing equipment including, but not limited to, the following tool types:

Dry etch equipment, and

Film deposition equipment (chemical vapor deposition [CVD] and physical vapor deposition [PVD]).

This Standard does not address any safety or performance issues related to RF emissions or electrical codes (e.g., Underwriter’s Laboratory, Inc. (UL), the National Electrical Code (NECâ), Federal Communications Commission (FCC)). It is the responsibility of the users of this standard to conform to the appropriate local codes and regulations as applied to this type of equipment, some of which are covered by related documents.

Referenced SEMI Standards (purchase separately)

None.

Revision History

SEMI E115-0302E (Reapproved 0923)

SEMI E115-0302E (Reapproved 0816)

SEMI E115-0302E (Reapproved 0309)

SEMI E115-0302E (editorial revision)

SEMI E115-0302 (first published)