Your New Favorite Mf037400 - Semi Mf374 - Test Method For Sheet Resistance Of Silicon Epitaxial, Diffused, Polysilicon, And Ion-implanted Layers Using An In-line Four-point Probe With The Single-configuration Procedure Save 75% Now [vba70WzP]

SEMI MF374: Precision Sheet Resistance Measurement

The SEMI MF037400 - SEMI MF374 is a comprehensive test method designed for precise measurement of sheet resistance in various types of silicon layers. This method is ideal for semiconductor manufacturers and researchers who require accurate and reliable measurements of thin layers formed by epitaxy, diffusion, or implantation. With its ability to measure sheet resistance in the range of 10 Ω to 5,000 Ω, inclusive, this test method ensures that your measurements are within the required specifications. Key features include direct measurement, single-configuration four-point probe, and applicable to circular samples with a diameter greater than 15.9 mm.

Robust and Versatile Testing Solution

The SEMI MF374 is a versatile tool that can be used on films with a thickness of at least 0.2 µm, making it suitable for a wide range of applications. The method includes procedures for preparing the specimen, measuring its size, and determining the temperature during the measurement, ensuring that all aspects of the testing process are covered. The inclusion of abbreviated tables of correction factors for circular geometry simplifies calculations and enhances convenience. Benefits of using this test method include:

Enhanced accuracy and reliability in sheet resistance measurements

Convenient and easy-to-use procedures for specimen preparation and measurement

Applicability to a wide range of semiconductor materials and applications

Comprehensive Support and Reference

The SEMI MF374 is supported by a range of referenced SEMI standards, including specifications for acetone, hydrofluoric acid, methanol, and nitrogen, as well as terminology for silicon technology. This ensures that users have access to all the necessary information and resources for accurate and consistent testing. The test method also includes procedures for checking both the probe head and the electrical measuring apparatus, ensuring the integrity of the measurements. Additional features include:

Direct measurement of average sheet resistance

Measurement at the center of the wafer for consistent results

Technical revisions and reapprovals for ongoing improvement