Stress-free G02500 - Semi G25 - Test Method For Measuring The Resistance Of Package Leads Add To Cart [8yzXxvPH]

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1984; previously published in 1989.

This Document defines the equipment, materials, and procedure used to measure the resistance of leads in packaging elements. This Document uses a pin grid (cavity down) package as one example of the type of packaging element that can be measured with the method described herein; however, this measurement technique can be applied to other geometrics with proper consideration.

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