Bestselling E02200 - Semi E22 - Specification For Cluster Tool Module Interface: Transport Module End Effector Exclusion Volume 35% Off - Today Only [suf3pEct]

SEMI E22 - Cluster Tool Module Interface Specification

The SEMI E22 specification is a vital document for the semiconductor industry, ensuring seamless and efficient wafer transport within cluster tools. This standard is meticulously designed to eliminate mechanical interference, providing a clear path for the transport module end effector to move wafers between process and cassette modules. Key features include a focus on wafer sizes from 100 mm up to 200 mm in diameter, ensuring compatibility with a wide range of semiconductor manufacturing processes.

• Improved wafer transport efficiency
• Reduced risk of mechanical damage

Technical Details and Specifications

The SEMI E22 specification outlines the exclusion volume necessary for the transport module end effector to operate without hindrance. This detailed description ensures that the end effector can access all critical areas within the process or cassette module. The standard is applicable to wafer sizes up to 200 mm, making it suitable for a broad spectrum of semiconductor manufacturing needs. Technical highlights include:

Comprehensive guidelines for exclusion volume

Compatibility with wafer sizes from 100 mm to 200 mm

Subordinate standards for further technical specifications

Practical Applications and Benefits

The SEMI E22 specification is an essential tool for semiconductor manufacturers aiming to enhance their cluster tool operations. By adhering to this standard, companies can achieve smoother wafer transport, leading to increased production efficiency and reduced downtime. This specification is particularly beneficial for manufacturers dealing with wafer sizes up to 200 mm, as it ensures compatibility and optimal performance. Target audience includes:

Wafer processing facilities

Cluster tool manufacturers

Equipment suppliers in the semiconductor industry