Hard To Find Aim Underfill Ff35, 10cc Syringe (10 Units) New Style [EZMSWAnX]

AIM Underfill FF35: Advanced Underfill Solution

AIM Underfill FF35 is a cutting-edge, one-component epoxy resin designed to enhance the reliability and performance of flip chip, CSP, BGA, and uBGA assemblies. This low surface tension underfill offers exceptional capillary action, ensuring a flat, fast, and complete spread for optimal assembly integrity. With its superior reliability, Underfill FF35 boasts high glass transition temperature (Tg), low coefficient of thermal expansion (CTE), and excellent adhesion properties, making it an ideal choice for demanding applications. Its compatibility with no-clean flux residues further simplifies the manufacturing process, while its rapid cure speeds and reworkability at 120°C (250°F) contribute to increased throughput and higher yields.

Key Product Properties and Specifications

Underfill FF35 is formulated to provide excellent capillary function for fast reflow, ensuring a uniform and consistent underfilling process. Its stable viscosity throughout its shelf life guarantees consistent performance, even after extended storage. The product offers superior storage properties, minimizing the risk of degradation or contamination. With no voiding and compatibility with no-clean flux residues, Underfill FF35 ensures a high-quality assembly with no post-processing required. Additionally, its fast flow characteristics and rapid cure speeds make it a time-efficient choice for high-volume manufacturing.

Practical Applications and Benefits

Underfill FF35 is a versatile solution suitable for a wide range of applications, including bare chip protection in small die packages. Its ability to provide excellent capillary action, compatibility with no-clean flux residues, and reworkability at 120°C (250°F) make it an ideal choice for manufacturers seeking to enhance the reliability and performance of their electronic assemblies. By using Underfill FF35, you can achieve faster throughput, higher yields, and improved overall product quality. Whether you are working on flip chip, CSP, BGA, or uBGA assemblies, this advanced underfill solution is designed to meet your needs and exceed your expectations.