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3DXSTAT™ ESD ABS: Advanced ESD-Safe Filament

The 3DXSTAT™ ESD ABS is a cutting-edge filament designed to offer unparalleled ESD protection and thermal stability, making it ideal for a wide range of applications. Crafted from high-flow ABS and enhanced with multi-wall carbon nanotubes (CNTs), this filament provides exceptional repeatability and reliability, ensuring consistent results every time. With a surface resistance of 10^7 to 10^9 Ohm, it outperforms competitors like Stratasys® ABS-ESD7, both in performance and cost-effectiveness.

Key Features and Benefits

The 3DXSTAT™ ESD ABS boasts several notable features that set it apart from other materials. Its proprietary formulation guarantees consistent surface resistivity, improved impact and elongation retention, and minimal particulate contamination. This not only ensures high-quality prints but also maintains a high level of cleanliness in critical applications. The filament also exhibits minimal contribution to outgassing and ionic contamination, making it suitable for use in environments where purity is paramount.

• High Flow ABS: Facilitates smooth extrusion and printing.
• Multi-Wall Carbon Nanotubes: Enhances thermal stability and conductivity.

Applications and Specifications

3DXSTAT™ ESD ABS is perfect for semi-conductor manufacturing, where it's used for components like HDDs, wafer handling, and casings. It's also ideal for industrial applications, including conveying, metering, and sensing. With a recommended extruder temperature of 220-240°C and a bed temperature of 100-110°C, this filament is easy to print and offers a range of benefits, such as a higher melting point and thermal properties compared to PLA or PETG. It's suitable for prototyping and end-use parts, catering to both industry engineers and hobbyists.

• Semiconductor Applications: HDD components, wafer handling, jigs, casings, and connectors.
• Industrial Applications: Conveying, metering, and sensing applications.