All-in-one Amat Applied Materials 0040-76132 200mm Wafer Blade Paddle End Effector Surplus Best Choice [zH6fcDm1]
AMAT Applied Materials 0040-76132 200mm Wafer Blade Paddle End EffectorIntroducing the AMAT Applied Materials 0040-76132 200mm Wafer Blade Paddle End Effector, a high-quality surplus item designed for precision handling in semiconductor manufacturing
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AMAT Applied Materials 0040-76132 200mm Wafer Blade Paddle End Effector
Introducing the AMAT Applied Materials 0040-76132 200mm Wafer Blade Paddle End Effector, a high-quality surplus item designed for precision handling in semiconductor manufacturing. This robust end effector is specifically crafted for 200mm wafer blades, ensuring seamless integration and optimal performance in your wafer processing equipment. With its reliable construction and efficient design, this end effector is a cost-effective solution for your semiconductor production needs.Key Features and Specifications
Experience the exceptional features of this AMAT Applied Materials end effector. It boasts a part number of 0040-76132 and is in excellent working condition, despite its surplus status. The end effector is equipped with a paddle design, which provides superior grip and stability during wafer handling. Key specifications include a 200mm blade size, ensuring compatibility with a wide range of wafer processing systems. The end effector also comes with a 90-day warranty, offering you peace of mind and assurance of its quality and reliability.Practical Uses and Benefits
Utilize this AMAT Applied Materials 0040-76132 200mm Wafer Blade Paddle End Effector in various semiconductor manufacturing applications. Its versatile design allows for efficient handling of wafer blades during various stages of production, including cutting, polishing, and inspection. The end effector's durable construction and reliable performance ensure minimal downtime and increased productivity. By incorporating this surplus end effector into your wafer processing equipment, you can enjoy the following benefits:- Enhanced wafer handling and stability
- Reduced production costs
- Increased equipment lifespan
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