Portable Amat Applied Materials 0020-34862 150mm Esc Electrostatic Chuck Pedestal Surplus Perfect For Gifting [1nw5CIqs]

AMAT Applied Materials 150mm ESC Electrostatic Chuck Pedestal

The AMAT Applied Materials 0020-34862 150mm ESC Electrostatic Chuck Pedestal is a high-quality surplus piece designed for semiconductor manufacturing. This durable pedestal is crafted with precision and is built to withstand rigorous industrial conditions. With its PEDSTL,150MM,FLAT(1S),5.679 DIA,ESC,SIMP model number, it is specifically engineered for applications requiring a 150mm diameter electrostatic chuck. The part number 0010-10982 corresponds to the shell assembly, ensuring a complete and functional unit.

Key Specifications and Features

This electrostatic chuck pedestal boasts a robust construction, with a diameter of 5.679 inches, providing a stable platform for semiconductor wafer processing. The pedestal is designed to work seamlessly with the AMAT 0020-34862 ESC system, offering compatibility and ease of integration. Key features include its flat design, which provides a uniform chuck surface, and the inclusion of the shell assembly for a complete solution. The pedestal is in good physical condition, with signs of previous use and handling, but it remains fully functional and ready for immediate installation.

Practical Applications and Benefits

The AMAT 150mm ESC Electrostatic Chuck Pedestal is a vital component in semiconductor manufacturing processes, offering numerous benefits. Its precision engineering ensures reliable performance and stability during wafer processing, contributing to the quality of the final product. With a 90-day warranty, customers can purchase with confidence, knowing that the product is backed by a reliable guarantee. Whether for research and development, production, or repair, this electrostatic chuck pedestal is an essential tool for semiconductor professionals. Its versatile design makes it suitable for a wide range of applications, providing a cost-effective solution for businesses looking to enhance their wafer handling capabilities.