Upgraded Version Mbga-ip Bga Reballing Stencil Kit For Iphone 7 To 15 Pro Max With Free Shipping [j6befuvC]

AMAOE Mbga-IP 22 in 1 BGA reballing stencil platform for Planting tin & Degumming CPU, hard drive, WIFI, baseband welding Repair. Mbga-IP WiFi/Baseband/CPU/NAND BGA Reballing Stencil Kit Soldering Steel Mesh Platform for iPhone 7 -14 Pro Max.

Option:
Mbga-IP 22 in 1 set ( 7-14PM)
Mbga-IP 14/14P kit Positioning plate
Mbga-IP 12/13 kit Positioning plate
Mbga-IP XS/11 kit Positioning plate
Mbga-IP 7/8/X Qualcomm kit Positioning plate
Mbga-IP 7/8/X Intel Kit Positioning plate
M-IP14-A16 stencil Kit (0.12mm)
M-IP14-A15 stencil Kit (0.12mm)
M-IP13 stencil Kit (0.12mm)
M-IP12 stencil Kit (0.12mm)
M-IP11 stencil Kit (0.12mm)
M-IPXS stencil Kit (0.12mm)
M-IP8 Qualcomm stencil(0.12mm)
M-IP8-i Intel stencil (0.12mm)
M-IP7 Qualcomm stencil (0.12mm)
M-IP7-i Intel stencil (0.12mm)
Mbga/MFix-UBase base

Features:
The compatible brand of our product is apple iPhone. Product original from CN(origin).
The compatible model is iPhone 7/7P/8/8P/X/XS/XS MAX/XR/11/11 Pro/11 Pro Max/12/12 mini/12 Pro/12 Pro Max/13/13 Pro/13 mini/13 Pro Max/14/14 Pro/14 Pro Max.
Tin planting and glue removal two-in-one design,Can be partially implanted with tin to remove glue and fix the chip.