Black Friday Doorbuster New Disco Zhzz-sd2000-h1-70 Bb Silicon Wafer Diamond Dicing Blades Massive 80% Savings [1jfhi0x3]

Black Friday Doorbuster New Disco Zhzz-sd2000-h1-70 Bb Silicon Wafer Diamond Dicing Blades Massive 80% Savings [1jfhi0x3]

Introducing the cutting-edge DISCO ZHZZ-SD2000-H1-70 BB Silicon Wafer Diamond Dicing Blades, a game-changer for precision dicing operations. These blades are designed to deliver exceptional performance and durability, making them the ideal choice for high-end semiconductor manufacturing. With their advanced diamond coating and robust construction, these blades ensure clean, precise cuts every time.

• High-quality diamond coating for superior cutting efficiency and longevity.
• Optimized for silicon wafers up to 200mm diameter, ensuring precision and consistency.

Product Specifications and Technical Details

The DISCO ZHZZ-SD2000-H1-70 BB Silicon Wafer Diamond Dicing Blades are engineered with precision and designed to meet the stringent requirements of modern semiconductor manufacturing. Key specifications include:

• Model Number: ZHZZ-SD2000-H1-70 BB
• Blade Type: Diamond Dicing Blade
• Applicable Wafer Diameter: Up to 200mm

These blades are built to last, offering reliable performance in repetitive cutting processes.

Practical Applications and Benefits

The DISCO ZHZZ-SD2000-H1-70 BB Silicon Wafer Diamond Dicing Blades are a valuable asset for semiconductor manufacturers and electronics engineers. Their superior cutting capabilities make them ideal for a variety of applications, including:

• IC and MEMS fabrication: Achieve precise dicing of silicon wafers for integrated circuits and microelectromechanical systems.
• High-reliability cutting: Ensure consistent and reliable performance in critical applications.

By investing in these high-quality blades, you can expect improved efficiency, reduced downtime, and enhanced overall productivity in your semiconductor manufacturing processes.