All-in-one Silverbullet Cmp Suspension - 64 Oz - 0.05 µm With Tracking [WnvDRYmX]

SilverBullet CMP Suspension: Unmatched Performance

Discover the power of the SilverBullet CMP Suspension, a cutting-edge polishing solution designed for precision applications. This unique blend of colloidal silica and polycrystalline alumina particles is formulated to deliver exceptional performance across a wide range of materials. With its advanced composition, SilverBullet CMP Suspension offers a perfect balance of chemical and mechanical properties, ensuring superior removal rates and optimal surface finish.

Key Features and Specifications

Experience the benefits of our 0.05 µm (50 nanometers) SilverBullet CMP Suspension, which boasts a pH range of 9.5 - 10 for enhanced compatibility with various materials. Our suspension contains 30% solids, ensuring a high concentration of active ingredients for efficient polishing. Here are some of the key features and specifications that set SilverBullet CMP Suspension apart:

Colloidal Silica: Provides a chemical contribution for superior polishing performance.

Polycrystalline Alumina: Enhances mechanical properties for improved removal rates.

Wide Range of Applications

Whether you are working on semiconductor manufacturing, precision engineering, or any other application that requires a high level of surface finish, SilverBullet CMP Suspension is the ideal choice. Its versatile nature makes it suitable for a variety of materials, including silicon, glass, and ceramics. With SilverBullet CMP Suspension, you can achieve the perfect balance between efficiency and quality, ensuring that your projects meet the highest standards of precision.